Research seminar series, week two: Heat Transfer Enhancement Methods at Mini Scale
Week two of the Faculty of Engineering and Applied Science's research seminar series goes Friday, Jan. 27 at 2 p.m. in EN-4032A in the S.J. Carew building.
The weekly seminar series is designed to highlight graduate student research and will feature a different speaker each Friday. The theme this week is 'Heat Transfer Enhancement Methods at Mini Scale' and will be presented by Mehdi Ghobadi, a PhD candidate with the Faculty of Engineering and Applied Science at Memorial University.
The following is an abstract of the seminar to be given by Mr. Ghobadi:
The recent trend of miniaturizing is prevailing in electronic devices aligning with increasing demand for higher performance and reliability require new methods for the heat removal system. Removing heat fluxes up to 10,000 12Wcm2'> which are generated by state-of-the-art chips in very small volume is needed.
Conventional air-based heat sinks have limited the heat transfer coefficient which needs to be extended. Liquid cooling operating micro channel networks as a heat sink and are known to be a promising approach to this heat transfer problem because of its plausible manufacturability at the chip level. However, even the upper range of heat fluxes achieved in such microchannel heat sinks will not meet the increasing demands of the electronics industry.
The main purpose of this study is to examine three passive techniques to enhance the heat transfer in comparison to an identical straight channel. Curved channel flow, flow through 90 degree bends and segmented flow are going to be studied. Examining segmented flow inside straight channels, segmented flow through curved channels and 90 degree bends will be studied in detail. Micro-PIV tests as a complementary visualization method will be used for all the above flows.
Refreshments and snacks are available following the presentation. Faculty, staff and students from across Memorial university are encouraged to attend